wangmy 7e18b3fc77 lapack: upgrade 3.10.0 -> 3.10.1
Changelog:
http://netlib.org/lapack/lapack-3.10.1.html

Signed-off-by: Wang Mingyu <wangmy@fujitsu.com>
Signed-off-by: Khem Raj <raj.khem@gmail.com>
Signed-off-by: Piotr Lewicki <piotr.l.lewicki@hitachienergy.com>
Signed-off-by: Armin Kuster <akuster808@gmail.com>
2025-03-07 19:18:02 -05:00
2025-03-07 19:18:02 -05:00
2025-03-06 09:48:58 -05:00
2019-06-15 16:45:33 -07:00

Collection of layers for the OE-core universe

Main layer maintainer: Armin Kuster <akuster808@gmail.com>

This repository is a collection of layers to suppliment OE-Core
with additional packages, Each layer have designated maintainer
Please see the respective READMEs in the layer subdirectories
Description
Collection of OpenEmbedded layers
https://openembedded.org/
Readme 94 MiB
Languages
BitBake 84.9%
Shell 6.3%
C 3%
Roff 2.2%
NASL 1.9%
Other 1.5%